Message ID | 1464362453-5732-1-git-send-email-michalx.k.jastrzebski@intel.com (mailing list archive) |
---|---|
State | Accepted, archived |
Delegated to: | Thomas Monjalon |
Headers |
Return-Path: <dev-bounces@dpdk.org> X-Original-To: patchwork@dpdk.org Delivered-To: patchwork@dpdk.org Received: from [92.243.14.124] (localhost [IPv6:::1]) by dpdk.org (Postfix) with ESMTP id 2B0E55AA3; Fri, 27 May 2016 17:21:06 +0200 (CEST) Received: from mga04.intel.com (mga04.intel.com [192.55.52.120]) by dpdk.org (Postfix) with ESMTP id CB6205A9D for <dev@dpdk.org>; Fri, 27 May 2016 17:21:03 +0200 (CEST) Received: from fmsmga001.fm.intel.com ([10.253.24.23]) by fmsmga104.fm.intel.com with ESMTP; 27 May 2016 08:21:02 -0700 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.26,374,1459839600"; d="scan'208";a="975811280" Received: from unknown (HELO Sent) ([10.217.248.103]) by fmsmga001.fm.intel.com with SMTP; 27 May 2016 08:21:00 -0700 Received: by Sent (sSMTP sendmail emulation); Fri, 27 May 2016 17:20:59 +0200 From: Michal Jastrzebski <michalx.k.jastrzebski@intel.com> To: dev@dpdk.org Date: Fri, 27 May 2016 17:20:52 +0200 Message-Id: <1464362453-5732-1-git-send-email-michalx.k.jastrzebski@intel.com> X-Mailer: git-send-email 2.7.0 Subject: [dpdk-dev] [PATCH] app/test: fix bond device name too long X-BeenThere: dev@dpdk.org X-Mailman-Version: 2.1.15 Precedence: list List-Id: patches and discussions about DPDK <dev.dpdk.org> List-Unsubscribe: <http://dpdk.org/ml/options/dev>, <mailto:dev-request@dpdk.org?subject=unsubscribe> List-Archive: <http://dpdk.org/ml/archives/dev/> List-Post: <mailto:dev@dpdk.org> List-Help: <mailto:dev-request@dpdk.org?subject=help> List-Subscribe: <http://dpdk.org/ml/listinfo/dev>, <mailto:dev-request@dpdk.org?subject=subscribe> Errors-To: dev-bounces@dpdk.org Sender: "dev" <dev-bounces@dpdk.org> |
Commit Message
Michal Jastrzebski
May 27, 2016, 3:20 p.m. UTC
Bond device name was too long (grather than 32 signs) that
cause mempool allocation to fail.
Fixes: 92073ef961ee ("bond: unit tests")
Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com>
---
app/test/test_link_bonding.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)
Comments
> -----Original Message----- > From: dev [mailto:dev-bounces@dpdk.org] On Behalf Of Michal Jastrzebski > Sent: Friday, May 27, 2016 4:21 PM > To: dev@dpdk.org > Subject: [dpdk-dev] [PATCH] app/test: fix bond device name too long > > Bond device name was too long (grather than 32 signs) that cause mempool > allocation to fail. > > Fixes: 92073ef961ee ("bond: unit tests") > > Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com> Acked-by: Bernard Iremonger<bernard.iremonger@intel.com>
2016-05-27 17:20, Michal Jastrzebski: > Bond device name was too long (grather than 32 signs) that > cause mempool allocation to fail. Maybe that this kind of failure would be avoided if the test was added to autotests (app/test/autotest_data.py). Generally speaking, it would be a good idea to make an audit on which tests are missing in "make fast_test" and "make test".
Tester-by: huilong xu<huilongx.xu@intel.com> Test case: link_bonging_autotest Package:dpdk.org master branch newest commit + this patch Test cmdline: ./x86_64-native-linuxapp-gcc/app/test -c ffff -n 1 Exec link_bonging_autotest cmdl Test environment: OS&kernel: dpdk-rhel72 3.10.0-327.el7.x86_64 Gcc: gcc version 4.8.5 20150623 (Red Hat 4.8.5-4) (GCC) Hugepage: 4096*2M > -----Original Message----- > From: dev [mailto:dev-bounces@dpdk.org] On Behalf Of Michal Jastrzebski > Sent: Friday, May 27, 2016 11:21 PM > To: dev@dpdk.org > Subject: [dpdk-dev] [PATCH] app/test: fix bond device name too long > > Bond device name was too long (grather than 32 signs) that > cause mempool allocation to fail. > > Fixes: 92073ef961ee ("bond: unit tests") > > Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com> > --- > app/test/test_link_bonding.c | 2 +- > 1 file changed, 1 insertion(+), 1 deletion(-) > > diff --git a/app/test/test_link_bonding.c b/app/test/test_link_bonding.c > index 7cbc289..eeb1395 100644 > --- a/app/test/test_link_bonding.c > +++ b/app/test/test_link_bonding.c > @@ -83,7 +83,7 @@ > #define MAX_PKT_BURST (512) > #define DEF_PKT_BURST (16) > > -#define BONDED_DEV_NAME ("unit_test_bonded_device") > +#define BONDED_DEV_NAME ("unit_test_bond_dev") > > #define INVALID_SOCKET_ID (-1) > #define INVALID_PORT_ID (-1) > -- > 1.7.9.5
Test case: link_bonging_autotest Package:dpdk.org master branch newest commit + this patch Test cmdline: ./x86_64-native-linuxapp-gcc/app/test -c ffff -n 1 Exec link_bonging_autotest cmdl Test environment: OS&kernel: dpdk-rhel72 3.10.0-327.el7.x86_64 Gcc: gcc version 4.8.5 20150623 (Red Hat 4.8.5-4) (GCC) Hugepage: 4096*2M > -----Original Message----- > From: dev [mailto:dev-bounces@dpdk.org] On Behalf Of Michal Jastrzebski > Sent: Friday, May 27, 2016 11:21 PM > To: dev@dpdk.org > Subject: [dpdk-dev] [PATCH] app/test: fix bond device name too long > > Bond device name was too long (grather than 32 signs) that > cause mempool allocation to fail. > > Fixes: 92073ef961ee ("bond: unit tests") > > Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com> Tested-by: huilong xu <huilongx.xu@intel.com> > --- > app/test/test_link_bonding.c | 2 +- > 1 file changed, 1 insertion(+), 1 deletion(-) > > diff --git a/app/test/test_link_bonding.c b/app/test/test_link_bonding.c > index 7cbc289..eeb1395 100644 > --- a/app/test/test_link_bonding.c > +++ b/app/test/test_link_bonding.c > @@ -83,7 +83,7 @@ > #define MAX_PKT_BURST (512) > #define DEF_PKT_BURST (16) > > -#define BONDED_DEV_NAME ("unit_test_bonded_device") > +#define BONDED_DEV_NAME ("unit_test_bond_dev") > > #define INVALID_SOCKET_ID (-1) > #define INVALID_PORT_ID (-1) > -- > 1.7.9.5
2016-05-27 18:38, Thomas Monjalon: > 2016-05-27 17:20, Michal Jastrzebski: > > Bond device name was too long (grather than 32 signs) that > > cause mempool allocation to fail. > > Maybe that this kind of failure would be avoided if the test > was added to autotests (app/test/autotest_data.py). > > Generally speaking, it would be a good idea to make an audit > on which tests are missing in "make fast_test" and "make test". Any comment please?
> -----Original Message----- > From: Thomas Monjalon [mailto:thomas.monjalon@6wind.com] > Sent: Wednesday, June 08, 2016 12:40 PM > To: Jastrzebski, MichalX K <michalx.k.jastrzebski@intel.com>; Iremonger, > Bernard <bernard.iremonger@intel.com> > Cc: dev@dpdk.org > Subject: Re: [dpdk-dev] [PATCH] app/test: fix bond device name too long > > 2016-05-27 18:38, Thomas Monjalon: > > 2016-05-27 17:20, Michal Jastrzebski: > > > Bond device name was too long (grather than 32 signs) that > > > cause mempool allocation to fail. > > > > Maybe that this kind of failure would be avoided if the test > > was added to autotests (app/test/autotest_data.py). > > > > Generally speaking, it would be a good idea to make an audit > > on which tests are missing in "make fast_test" and "make test". > > Any comment please? Hi Thomas, There is a small timeout in test_tlb_tx_burst - big burst has to be generated to detect balancing and small timeout has to be included between each burst, thus I am not sure if link_bonding_autotest can be classified to fast tests (test takes about 3-4 seconds). We can add this test to autotests script for which time is not so critical. Best regards Michal
2016-06-08 11:50, Jastrzebski, MichalX K: > From: Thomas Monjalon [mailto:thomas.monjalon@6wind.com] > > 2016-05-27 18:38, Thomas Monjalon: > > > 2016-05-27 17:20, Michal Jastrzebski: > > > > Bond device name was too long (grather than 32 signs) that > > > > cause mempool allocation to fail. > > > > > > Maybe that this kind of failure would be avoided if the test > > > was added to autotests (app/test/autotest_data.py). > > > > > > Generally speaking, it would be a good idea to make an audit > > > on which tests are missing in "make fast_test" and "make test". > > > > Any comment please? > > Hi Thomas, > > There is a small timeout in test_tlb_tx_burst - big burst has to be generated to > detect balancing and small timeout has to be included between each burst, > thus I am not sure if link_bonding_autotest can be classified to fast tests > (test takes about 3-4 seconds). > We can add this test to autotests script for which time is not so critical. The bug we see here could be detected by just initializing bonding. Maybe we can consider having some basic/fast tests and others longer.
> -----Original Message----- > From: Thomas Monjalon [mailto:thomas.monjalon@6wind.com] > Sent: Wednesday, June 08, 2016 3:31 PM > To: Jastrzebski, MichalX K <michalx.k.jastrzebski@intel.com> > Cc: Iremonger, Bernard <bernard.iremonger@intel.com>; dev@dpdk.org > Subject: Re: [dpdk-dev] [PATCH] app/test: fix bond device name too long > > 2016-06-08 11:50, Jastrzebski, MichalX K: > > From: Thomas Monjalon [mailto:thomas.monjalon@6wind.com] > > > 2016-05-27 18:38, Thomas Monjalon: > > > > 2016-05-27 17:20, Michal Jastrzebski: > > > > > Bond device name was too long (grather than 32 signs) that > > > > > cause mempool allocation to fail. > > > > > > > > Maybe that this kind of failure would be avoided if the test > > > > was added to autotests (app/test/autotest_data.py). > > > > > > > > Generally speaking, it would be a good idea to make an audit > > > > on which tests are missing in "make fast_test" and "make test". > > > > > > Any comment please? > > > > Hi Thomas, > > > > There is a small timeout in test_tlb_tx_burst - big burst has to be > generated to > > detect balancing and small timeout has to be included between each > burst, > > thus I am not sure if link_bonding_autotest can be classified to fast tests > > (test takes about 3-4 seconds). > > We can add this test to autotests script for which time is not so critical. > > The bug we see here could be detected by just initializing bonding. > Maybe we can consider having some basic/fast tests and others longer. Actually this particular bug does not happen during bonding initialization, but only after user will configure bond device in mode 6 (ALB). As only in mode 6 we need mempool allocation and we do rte_pktmbuf_pool_create giving as a mempool name - bond device name BONDED_DEV_NAME. Best regards Michal
> > Bond device name was too long (grather than 32 signs) that cause mempool > > allocation to fail. > > > > Fixes: 92073ef961ee ("bond: unit tests") > > > > Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com> > > Acked-by: Bernard Iremonger<bernard.iremonger@intel.com> Applied, thanks
diff --git a/app/test/test_link_bonding.c b/app/test/test_link_bonding.c index 7cbc289..eeb1395 100644 --- a/app/test/test_link_bonding.c +++ b/app/test/test_link_bonding.c @@ -83,7 +83,7 @@ #define MAX_PKT_BURST (512) #define DEF_PKT_BURST (16) -#define BONDED_DEV_NAME ("unit_test_bonded_device") +#define BONDED_DEV_NAME ("unit_test_bond_dev") #define INVALID_SOCKET_ID (-1) #define INVALID_PORT_ID (-1)