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GET /api/patches/92068/?format=api
{ "id": 92068, "url": "http://patches.dpdk.org/api/patches/92068/?format=api", "web_url": "http://patches.dpdk.org/project/dpdk/patch/1619171202-28486-1-git-send-email-tangchengchang@huawei.com/", "project": { "id": 1, "url": "http://patches.dpdk.org/api/projects/1/?format=api", "name": "DPDK", "link_name": "dpdk", "list_id": "dev.dpdk.org", "list_email": "dev@dpdk.org", "web_url": "http://core.dpdk.org", "scm_url": "git://dpdk.org/dpdk", "webscm_url": "http://git.dpdk.org/dpdk", "list_archive_url": "https://inbox.dpdk.org/dev", "list_archive_url_format": "https://inbox.dpdk.org/dev/{}", "commit_url_format": "" }, "msgid": "<1619171202-28486-1-git-send-email-tangchengchang@huawei.com>", "list_archive_url": "https://inbox.dpdk.org/dev/1619171202-28486-1-git-send-email-tangchengchang@huawei.com", "date": "2021-04-23T09:46:40", "name": "[0/2] add Tx prepare support for bonding device", "commit_ref": null, "pull_url": null, "state": null, "archived": false, "hash": null, "submitter": { "id": 1792, "url": "http://patches.dpdk.org/api/people/1792/?format=api", "name": "Chengchang Tang", "email": "tangchengchang@huawei.com" }, "delegate": null, "mbox": "http://patches.dpdk.org/project/dpdk/patch/1619171202-28486-1-git-send-email-tangchengchang@huawei.com/mbox/", "series": [], "comments": "http://patches.dpdk.org/api/patches/92068/comments/", "check": "pending", "checks": "http://patches.dpdk.org/api/patches/92068/checks/", "tags": {}, "related": [], "headers": { "Return-Path": "<dev-bounces@dpdk.org>", "X-Original-To": "patchwork@inbox.dpdk.org", "Delivered-To": "patchwork@inbox.dpdk.org", "Received": [ "from mails.dpdk.org (mails.dpdk.org [217.70.189.124])\n\tby inbox.dpdk.org (Postfix) with ESMTP id 40A00A0548;\n\tFri, 23 Apr 2021 11:46:48 +0200 (CEST)", "from [217.70.189.124] (localhost [127.0.0.1])\n\tby mails.dpdk.org (Postfix) with ESMTP id C61B941DD7;\n\tFri, 23 Apr 2021 11:46:40 +0200 (CEST)", "from szxga04-in.huawei.com (szxga04-in.huawei.com [45.249.212.190])\n by mails.dpdk.org (Postfix) with ESMTP id 73648410E3\n for <dev@dpdk.org>; Fri, 23 Apr 2021 11:46:37 +0200 (CEST)", "from DGGEMS412-HUB.china.huawei.com (unknown [172.30.72.58])\n by szxga04-in.huawei.com (SkyGuard) with ESMTP id 4FRTrp4kj9z1BH7M;\n Fri, 23 Apr 2021 17:44:10 +0800 (CST)", "from localhost.localdomain (10.69.192.56) by\n DGGEMS412-HUB.china.huawei.com (10.3.19.212) with Microsoft SMTP Server id\n 14.3.498.0; Fri, 23 Apr 2021 17:46:26 +0800" ], "From": "Chengchang Tang <tangchengchang@huawei.com>", "To": "<dev@dpdk.org>", "CC": "<linuxarm@huawei.com>, <chas3@att.com>, <humin29@huawei.com>,\n <ferruh.yigit@intel.com>, <konstantin.ananyev@intel.com>", "Date": "Fri, 23 Apr 2021 17:46:40 +0800", "Message-ID": "<1619171202-28486-1-git-send-email-tangchengchang@huawei.com>", "X-Mailer": "git-send-email 2.7.4", "In-Reply-To": "<1618571071-5927-1-git-send-email-tangchengchang@huawei.com>", "References": "<1618571071-5927-1-git-send-email-tangchengchang@huawei.com>", "MIME-Version": "1.0", "Content-Type": "text/plain", "X-Originating-IP": "[10.69.192.56]", "X-CFilter-Loop": "Reflected", "Subject": "[dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device", "X-BeenThere": "dev@dpdk.org", "X-Mailman-Version": "2.1.29", "Precedence": "list", "List-Id": "DPDK patches and discussions <dev.dpdk.org>", "List-Unsubscribe": "<https://mails.dpdk.org/options/dev>,\n <mailto:dev-request@dpdk.org?subject=unsubscribe>", "List-Archive": "<http://mails.dpdk.org/archives/dev/>", "List-Post": "<mailto:dev@dpdk.org>", "List-Help": "<mailto:dev-request@dpdk.org?subject=help>", "List-Subscribe": "<https://mails.dpdk.org/listinfo/dev>,\n <mailto:dev-request@dpdk.org?subject=subscribe>", "Errors-To": "dev-bounces@dpdk.org", "Sender": "\"dev\" <dev-bounces@dpdk.org>" }, "content": "This patch set add Tx prepare for bonding device.\n\nCurrently, the bonding driver has not implemented the callback of\nrte_eth_tx_prepare function. Therefore, the TX prepare function of the\nslave devices will never be invoked. When hardware offloading such as\nCKSUM and TSO are enabled for some drivers, tx_prepare needs to be used\nto adjust packets (for example, set correct pseudo packet headers).\nOtherwise, related offloading fails and even packets are sent\nincorrectly. Due to this limitation, the bonded device cannot use these\nHW offloading in the Tx direction.\n\nBecause packet sending algorithms are numerous and complex in bond PMD,\nit is hard to design the callback for rte_eth_tx_prepare. In this\npatchset, the tx_prepare callback of bonding PMD is not implemented.\nInstead, rte_eth_tx_prepare has been called in tx_burst callback. In\nthis way, all tx_offloads can be processed correctly for all NIC devices.\nIt is the responsibility of the slave PMDs to decide when the real\ntx_prepare needs to be used. If tx_prepare is not required in some cases,\nthen slave PMDs tx_prepare pointer should be NULL and rte_eth_tx_prepare()\nwill be just a NOOP. That is, the effectiveness and security of tx_prepare\nand its impact on performance depend on the design of slave PMDs.\n\nAnd configuring Tx offloading for bonding is also added in this patchset.\nThis solves the problem that we need to configure slave devices one by one\nwhen configuring Tx offloading.\n\nChengchang Tang (2):\n net/bonding: support Tx prepare for bonding\n net/bonding: support configuring Tx offloading for bonding\n\n drivers/net/bonding/rte_eth_bond.h | 1 -\n drivers/net/bonding/rte_eth_bond_pmd.c | 41 ++++++++++++++++++++++++++++++----\n 2 files changed, 37 insertions(+), 5 deletions(-)\n\n--\n2.7.4", "diff": null, "prefixes": [ "0/2" ] }