From patchwork Mon Jan 7 13:01:04 2019 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Hari Kumar Vemula X-Patchwork-Id: 49475 X-Patchwork-Delegate: ferruh.yigit@amd.com Return-Path: X-Original-To: patchwork@dpdk.org Delivered-To: patchwork@dpdk.org Received: from [92.243.14.124] (localhost [127.0.0.1]) by dpdk.org (Postfix) with ESMTP id 9B57F1B461; Mon, 7 Jan 2019 14:01:53 +0100 (CET) Received: from mga02.intel.com (mga02.intel.com [134.134.136.20]) by dpdk.org (Postfix) with ESMTP id 988F91B45A; Mon, 7 Jan 2019 14:01:51 +0100 (CET) X-Amp-Result: SKIPPED(no attachment in message) X-Amp-File-Uploaded: False Received: from orsmga008.jf.intel.com ([10.7.209.65]) by orsmga101.jf.intel.com with ESMTP/TLS/DHE-RSA-AES256-GCM-SHA384; 07 Jan 2019 05:01:49 -0800 X-ExtLoop1: 1 X-IronPort-AV: E=Sophos;i="5.56,451,1539673200"; d="scan'208";a="107873137" Received: from irvmail001.ir.intel.com ([163.33.26.43]) by orsmga008.jf.intel.com with ESMTP; 07 Jan 2019 05:01:48 -0800 Received: from wgcvswdev001.ir.intel.com (wgcvswdev001.ir.intel.com [10.102.246.100]) by irvmail001.ir.intel.com (8.14.3/8.13.6/MailSET/Hub) with ESMTP id x07D1lMB005943; Mon, 7 Jan 2019 13:01:47 GMT Received: from wgcvswdev001.ir.intel.com (localhost [127.0.0.1]) by wgcvswdev001.ir.intel.com with ESMTP id x07D1Fnd012264; Mon, 7 Jan 2019 13:01:15 GMT Received: (from hvemulax@localhost) by wgcvswdev001.ir.intel.com with ? id x07D1FXM012260; Mon, 7 Jan 2019 13:01:15 GMT From: Hari Kumar Vemula To: dev@dpdk.org Cc: reshma.pattan@intel.com, declan.doherty@intel.com, jananeex.m.parthasarathy@intel.com, Hari Kumar Vemula , stable@dpdk.org Date: Mon, 7 Jan 2019 13:01:04 +0000 Message-Id: <1546866064-11929-1-git-send-email-hari.kumarx.vemula@intel.com> X-Mailer: git-send-email 1.7.0.7 In-Reply-To: References: Subject: [dpdk-dev] [PATCH] net/bonding: fix create bonded device test failure X-BeenThere: dev@dpdk.org X-Mailman-Version: 2.1.15 Precedence: list List-Id: DPDK patches and discussions List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Errors-To: dev-bounces@dpdk.org Sender: "dev" Create bonded device test is failing due to improper initialisation in bonded device configuration. which leads to crash while setting up queues. The value of nb_rx_desc is checked if it is not in range of rx_desc_lim of bonded device which fails. This is due to "rx_desc_lim" is set to 0 as default value of bonded device during bond_alloc(). Hence nb_rx_desc (1024) is > 0 and test fails. Fix is to set the default values of rx_desc_lim of bonded device to appropriate value. Fixes: 2efb58cbab ("bond: new link bonding library") Cc: stable@dpdk.org Signed-off-by: Hari Kumar Vemula --- drivers/net/bonding/rte_eth_bond_pmd.c | 11 +++++++---- 1 file changed, 7 insertions(+), 4 deletions(-) diff --git a/drivers/net/bonding/rte_eth_bond_pmd.c b/drivers/net/bonding/rte_eth_bond_pmd.c index 44deaf119..e0888e960 100644 --- a/drivers/net/bonding/rte_eth_bond_pmd.c +++ b/drivers/net/bonding/rte_eth_bond_pmd.c @@ -2225,6 +2225,11 @@ static void bond_ethdev_info(struct rte_eth_dev *dev, struct rte_eth_dev_info *dev_info) { struct bond_dev_private *internals = dev->data->dev_private; + struct rte_eth_desc_lim bond_lim = { + .nb_max = UINT16_MAX, + .nb_min = 0, + .nb_align = 1, + }; uint16_t max_nb_rx_queues = UINT16_MAX; uint16_t max_nb_tx_queues = UINT16_MAX; @@ -2263,10 +2268,8 @@ bond_ethdev_info(struct rte_eth_dev *dev, struct rte_eth_dev_info *dev_info) memcpy(&dev_info->default_txconf, &internals->default_txconf, sizeof(dev_info->default_txconf)); - memcpy(&dev_info->rx_desc_lim, &internals->rx_desc_lim, - sizeof(dev_info->rx_desc_lim)); - memcpy(&dev_info->tx_desc_lim, &internals->tx_desc_lim, - sizeof(dev_info->tx_desc_lim)); + dev_info->rx_desc_lim = bond_lim; + dev_info->tx_desc_lim = bond_lim; /** * If dedicated hw queues enabled for link bonding device in LACP mode