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[RFC,0/2] add Tx prepare support for bonding device

Message ID 1618571071-5927-1-git-send-email-tangchengchang@huawei.com (mailing list archive)
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Chengchang Tang April 16, 2021, 11:04 a.m. UTC 
  This patch add Tx prepare for bonding device.

Currently, the bonding driver has not implemented the callback of
rte_eth_tx_prepare function. Therefore, the TX prepare function of the
slave devices will never be invoked. When hardware offloading such as
CKSUM and TSO are enabled for some drivers, tx_prepare needs to be used
to adjust packets (for example, set correct pseudo packet headers).
Otherwise, related offloading fails and even packets are sent
incorrectly. Due to this limitation, the bonded device cannot use these
HW offloading in the Tx direction.

Because packet sending algorithms are numerous and complex in bond PMD,
it is hard to design the callback for rte_eth_tx_prepare. In this patch,
the tx_prepare callback of bonding PMD is not implemented. Instead,
rte_eth_tx_prepare has been called in tx_burst callback. And a global
variable is introduced to control whether the bonded device need call
the rte_eth_tx_prepare. If upper-layer users need to use some TX
offloading that depend on tx_prepare , they should enable the preparation
function. In this way, the bonded device will call the rte_eth_tx_prepare
for the fast path packets in the tx_burst callback.

Chengchang Tang (2):
  net/bonding: add Tx prepare for bonding
  app/testpmd: add cmd for bonding Tx prepare

 app/test-pmd/cmdline.c                      | 66 +++++++++++++++++++++++++++++
 doc/guides/testpmd_app_ug/testpmd_funcs.rst |  9 ++++
 drivers/net/bonding/eth_bond_private.h      |  1 +
 drivers/net/bonding/rte_eth_bond.h          | 29 +++++++++++++
 drivers/net/bonding/rte_eth_bond_api.c      | 28 ++++++++++++
 drivers/net/bonding/rte_eth_bond_pmd.c      | 33 +++++++++++++--
 drivers/net/bonding/version.map             |  5 +++
 7 files changed, 167 insertions(+), 4 deletions(-)

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2.7.4